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Technical Data Sheet
3mm POWER LED
33-01/G4C-ARTB
Everlight Electronics Co., Ltd. http:\\www.everlight.com Rev.1 Page: 8 of 10
Device number: DPE-0000057 Established date: 05-30-2008 Established by: Jim Lin
particularly when soldering.
Dip and hand soldering should not be done more than one time
After soldering the LEDs, the epoxy bulb should be protected from mechanical shock or
vibration until the LEDs return to room temperature.
A rapid-rate process is not recommended for cooling the LEDs down from the peak
temperature.
Although the recommended soldering conditions are specified in the above table, dip or
handsoldering at the lowest possible temperature is desirable for the LEDs.
Wave soldering parameter must be set and maintain according to recommended
temperature and dwell time in the solder wave.
4. Cleaning
When necessary, cleaning should occur only with isopropyl alcohol at room temperature for
a duration of no more than one minute. Dry at room temperature before use.
Do not clean the LEDs by the ultrasonic. When it is absolutely necessary, the influence of
ultrasonic cleaning on the LEDs depends on factors such as ultrasonic power and the
assembled condition. Ultrasonic cleaning shall be pre-qualified to ensure this will not cause
damage to the LED
5. Circuit Protection
Below the zener reference voltage Vz, all the current flows through LED and as the voltage
rises to Vz, the zener diode breakdown." If the voltage tries to rise above Vz current flows
through the zener branch to keep the voltage at exactly Vz.
When the LED is connected using serial circuit, if either piece of LED is no light up but
current cant flow through causing others to light down. In new design, the LED is parallel
with zener diode. if either piece of LED is no light up but current can flow through causing
others to light up.
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